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| Multilayer Chip Inductors LL2012-FHL Series Inductance Range: 1.5~680nH (E-12) Temperature Coefficient of L: + 250ppm/C (for reference only) FEATURES * New specifications * Dual frequency standard for inductance value * Supports high temperature reflow soldering (260C, 3 times) * Surface mounting applicability (Supports both reflow and flow soldering) * High reliability (ceramic integrated structure, and terminals plated) * * * * * DIMENSIONS Length L (mm) Marking of polarity (Black) L W 2.0 0.2 Width W (mm) 1.25 0.2 Thickness T (mm) 0.6 0.2 (1.5~8.2nH) 0.85 0.3 (10.0~39.0nH) 1.0 0.3 (47.0~100nH) 1.2 0.3 (120.0~680nH) Electrode widthA (mm) 0.5 0.3 T A * Marking of polarity: Marking is on the upper surface of the unit. * ELECTRICAL CHARACTERISTICS * Inductance Range * Inductance Tolerance 1.5~680nH (E-12 Series) S ; 0.3nH (1.5~5.6nH) J ; 5% (6.8~680nH) K ; 10%, (3.3~680nH) 22 ~ 65 (at 800MHz) 50~300mA + 250ppm/C - 40~+ 100C - 40~+ 100C * * * Q (Typical) * Rated Current * L Temperature Coefficient (for reference only) * Operating Temperature Range * Storage Temperature Range * * * * * EXAMPLES OF CHARACTERISTICS Inductance vs Frequency 10,000 100 Q vs Frequency 3N3 82N R39 3N3 82N R39 80 1,000 Inductance (nH) 60 Q 40 20 0 10 100 10 1 10 100 1,000 10,000 100 1,000 10,000 f(MHz) f (MHz) continued on next page Multilayer Chip Inductors continued from previous page TOKO STANDARD PART NUMBERS TYPE LL2012-FHLSeries (Quantity/reel; ~39nH [4,000 PCS], 47nH~ [3,000 PCS]) Inductance & Tolerance TOKO part number LL2012-FHL1N5S LL2012-FHL1N8S LL2012-FHL2N2S LL2012-FHL2N7S LL2012-FHL3N3S LL2012-FHL3N9S LL2012-FHL4N7S LL2012-FHL5N6S LL2012-FHL6N8J LL2012-FHL8N2J LL2012-FHL10NJ LL2012-FHL12NJ LL2012-FHL15NJ LL2012-FHL18NJ LL2012-FHL22NJ LL2012-FHL27NJ LL2012-FHL33NJ LL2012-FHL39NJ LL2012-FHL47NJ LL2012-FHL56NJ LL2012-FHL68NJ LL2012-FHL82NJ at 100MHz at 800(500, 300, 200)MHz L TolerL Toler- Freq. (nH) ance (nH) ance (MHz) 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 S S S S S S S S J J J J J J J J J J J J J J J J J J J J J J J J J 1.5 0.5nH 1.7 0.5nH 2.1 0.5nH 2.42 0.5nH 3.0 0.5nH 3.7 0.5nH 4.6 0.5nH 5.7 0.5nH 6.7 8.2 10.2 12.7 15.8 19.5 24.5 31.2 38.5 50.7 63.9 62.7 80.3 103 142 139 173 194 234 303 382 500 - - - 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% - - - 800 800 800 800 800 800 800 800 800 800 800 800 800 800 800 800 800 800 800 500 500 500 500 300 300 200 200 200 200 200 - - - Q Min. 100 MHz 11 12 12 12 12 12 12 12 12 15 15 16 16 16 16 16 16 16 17 17 17 20 20 16* 16* 10** 10** 11** 11** 11** 11** 11** 11** 100 MHz 15.3 14.0 16.7 15.5 15.4 16.0 16.5 17.0 18.7 18.5 18.9 20.5 22.1 22.9 21.6 22.8 23.0 24.6 24.8 26.1 25.7 26.5 27.7 26.4 29.2 28.2 25.1 23.6 26.0 25.0 25.5 24.5 26.5 300 MHz 27.5 25.0 29.5 27.5 29.0 29.7 30.4 31.3 33.3 32.2 33.7 36.5 39.5 40.7 38.0 39.6 39.9 41.4 41.8 43.3 41.8 41.4 43.3 38.2 40.3 33.2 32.8 28.8 28.6 21.1 - - - Q Typ. 500 MHz 37.5 33.9 39.9 36.8 39.2 39.7 40.9 42.1 44.6 42.4 44.4 47.5 51.5 52.9 48.6 49.4 49.9 50.0 49.5 50.0 46.2 43.1 41.4 31.0 29.6 - - - - - - - - 800 MHz 52.0 46.6 55.0 50.8 52.6 53.4 54.3 55.2 58.1 54.8 56.9 60.8 64.2 64.9 56.8 57.4 55.6 50.9 47.4 44.5 33.6 21.5 - - - - - - - - - - - 1000 MHz 61.5 54.0 62.6 57.8 59.2 59.7 61.0 61.0 63.9 59.5 61.5 65.9 68.2 68.4 57.4 57.3 54.4 45.5 39.4 34.5 18.1 - - - - - - - - - - - - 1800 MHz 79.3 78.4 96.4 89.0 96.4 76.8 81.0 76.9 89.7 73.2 75.7 79.8 67.9 49.3 - - - - - - - - - - - - - - - - - - - S.R.F (MHz) Min. 4000 4000 3800 3600 3400 3200 2800 2800 2100 2000 1600 1350 1350 1200 1100 1100 1000 900 800 750 700 600 550 500 450 400 360 330 300 270 240 210 180 RDC () Max. 0.10 0.10 0.10 0.10 0.10 0.10 0.12 0.15 0.15 0.18 0.20 0.22 0.24 0.26 0.28 0.30 0.40 0.50 0.55 0.60 0.65 0.70 0.80 0.85 0.90 1.00 3.00 3.50 4.00 4.50 5.00 5.50 6.00 RDC () Typ. 0.02 0.02 0.03 0.03 0.04 0.04 0.03 0.05 0.06 0.05 0.06 0.07 0.11 0.10 0.09 0.12 0.13 0.13 0.21 0.23 0.24 0.28 0.33 0.32 0.44 0.51 2.15 3.22 2.86 3.82 2.58 2.69 3.14 IDC (mA) Max. 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 250 250 250 200 200 150 150 50 50 50 3 LL2012-FHLR10J 100 LL2012-FHLR12J 120* LL2012-FHLR15J 150* LL2012-FHLR18J 180* LL2012-FHLR22J 220* LL2012-FHLR27J 270** LL2012-FHLR33J 330** LL2012-FHLR39J 390** LL2012-FHLR47J 470** LL2012-FHLR56J 560** LL2012-FHLR68J 680** * at 50MHz, ** at 25MHz *Test Equipment & note * L, Q * S.R.F. * RDC * Inductance tolerance * Operating temperature range * Storage temperature range : RF Impedance Analyzer 4291A/B (Agilent), Test Fixture 16192A (Agilent) Network Analyzer 8719D (Agilent), 8720D (Agilent) : Milliohmmeter 4338A/B (Agilent) S=0.3nH, J=5% -40C~+100C -40C~+100C Multilayer and Thick FilmChip Inductors LLV0603-FB * LLV0603-F * LL1005-FH L * LL1608-FSL LL2012-FHL* LLP1005-FH Series FEATURES * Lineup of shape series expanded from 0603 size to 2012 * * * * * * * * * * * * * * * size. Expanded inductance range covering 1.0 nH~680 nH. Realization of product lineup that includes the addition of B class tolerance, aiming at narrow tolerance. High frequency characteristics: Can be used over the range 400 MHz~10 GHz. Lineup of a series that can be soldered with lead-less solder. Lineup of a non-polarity series. Lineup of a series that has an expanded working temperature range of -55C~+125C. Improved L value reliability: Lineup of a series whose L value is controlled by two frequencies (100 MHz and 800 MHz). PRECAUTIONS 1. Precaution for application 1.1 The part must be pre-heated before soldering if reflow or flow solder is applied. The difference between pre-heat temperature and soldering temperature must be within 150C. 1.2 If a solder iron is applied, the soldering process must be completed within 3 seconds at the soldering temperature lower than 260C. The tip of the solder iron must not touch the terminal electrode in this process. 1.3 Soldering by using an iron must be only once for the same part. 1.4 PCB mounted this part must be handled with a care to minimize any physical stress to the part at the board assembly process. 1.5 To minimize the influence to the part, the thickness of PCB, land dimension, and the amount of solder must be evaluated carefully by individual application. 1.6 CFC, triethance, and isopropil used for the washing process will not affect the part performance. 2. Precaution of storage Storage condition is critical to maintain an optimum soldering performance. 2.1 Environmental requirements: Control ambient temperature at or under 40C and 70%RH. Recommended use of the products within 6 months. 2.2 Influence of harmful gas: Store the products in a place isolated from harmful gases like sulfer and chlorine. Multilayer and Thick FilmChip Inductors PART NUMBERING SYSTEM Example LL 1608 FS Tolerance Inductance Material Physical Dimensions TOKO's Type name Inductance Unit is nH and 3 digits are used. The value is indicated as shown below. Example 4N7...4.7nH 33N...33nH R27...270nH Tolerance for the Inductance Mark B C S G T J K M Tolerance 0.1nH 0.2nH 0.3nH 2% 3% 5% 10% 20% 3 REEL PACKAGING (1) Chip's placing Chip Inductors are packaged into 8mm width, 4 or 2mm pitch plastic or paper tape then enclosed by cover tape. (2) Carriage hole position Carriage hole position is right side of tape when sealing tape is up side. * Tape dimensions (Unit: mm) 1.750.1 P=4.00.1 2.00.05 ( mm) * Reel dimensions (Unit: mm) T3 ( mm) 1.550.05 T1 Label 180 (330) 13 8.00.2 3.50.05 C 21 A B T2 9.0 (9.5) () o330 11.4 (13.5) Type A B C T1 T2 Max. 2.0 0.3 2.3 1.5 LL2012 4 Max. 1.4 0.2 1.8 1.0 LL1608 -- -- 1.12 0.62 LL1005 -- -- 1.15 0.67 2 LLP1005 -- -- 0.65 0.35 LLV0603 * Label: Customer's P/N, Q'ty, TOKO P/N, TOKO, INC. T3 -- -- Max. 0.8 Max. 0.8 Max. 0.8 Material (Tape) Plastic Paper QTY (O180) ~39nH:4000, 47nH~3000PCS/reel 4000PCS/reel 10,000PCS/reel 10,000PCS/reel 15,000PCS/reel * 60 (100) 2 Multilayer and Thick FilmChip Inductors SOLDERING CONDITIONS Recommended Pattern c b a b a b c LL2012 series Flow soldering Reflow soldering 1.0~1.4 1.0~1.2 0.8~1.2 0.6~1.0 0.8~1.0 0.8~1.2 Pattern dimensions (unit; mm) LL1608 series LL1005 & LLP1005 series Flow soldering Reflow soldering Reflow soldering 0.8~1.0 0.7 0.4 0.8~1.0 0.6~0.8 0.4~0.5 0.6~0.8 0.6~0.8 0.45~0.55 LLV0603 series Reflow soldering 0.25 0.18~0.22 0.30~0.35 * Conditions for soldering temperatures are determined as per figures below after prior confirmation that abnormalities are not evident. * Flow Soldering 7s. 230 5C 240C 20s. 225C 140~170C 80 20C 2min. 80s. 2min. 150 10C 2min. Reflow Soldering Soldering Iron 2s. 250 10C Solder iron power 18W ELECTRICAL CHARACTERISTICS TEST METHOD 1. INDUCTANCE, Q * Test equipment * Impedance analyzer: 4291A/B(Agilent):LL1005-FHL, LL1608-FSL, LL2012-FHL, LLP1005-FH, LLV0603-FB, LLV0603-F, *Test fixture: 16192A(Agilent): LL1005-FHL, LL1608-FSL, LL2012-FHL 16196B(Agilent): LLP1005-FH 16196C(Agilent): LLV0603-FB, LLV0603-F * Test method * Set measuring frequency read inductance and Q value. 2. RDC (DC Resistance) * Test equipment * 4338A/B(Agilent) or equivalent * Test method (1) Place the sample in the test terminals. (2) Do not place in or pull out the sample while pushing SW. * * * * * * * * Test Circuit DC RESISTANCE TESTER SW INDUCTOR SAMPLE SW 3. Self resonance frequency (S.R.F.) * Test equipment * Network Analyzer: 8719D(Agilent):0.5GHz 13.5GHz 8720D(Agilent):13.6GHz 20.0GHz * * * * * Test Method * Measure the frequency at which the phase of inductive reactance and capacitive reactance is 0. Multilayer and Thick FilmChip Inductors MECHANICAL & ENVIRONMENTAL CHARACTERISTICS Item Specification Criteria Soldered chip on PC board is to be bent down to 2mm as below drawing Mechanical Characteristics Bending test No apparent damage Vibration test Resistance to soldering heat Solderability test Humidity test Environmental Characteristics Dry Heat test Cold test No apparent damage L : within 10% Q: within 20% No apparent damage Terminal extant % : more than 90% No apparent damage Terminal surface wet % : more than 90% No apparent damage L : within 10% Q: within 20% No apparent damage L : within 10% Q: within 20% No apparent damage L : within 10% Q: within 20% No apparent damage L : within 10% Q: within 20% L : within 10% (Typical: +250 ppm/C) Apply frequency 10~55Hz, 1.5mm amplitude for each perpendiculer direction of 2 hours. Pre-heat at 160C, 2~3 minutes. Soak into the molten solder bath of 2605C at 100.5 seconds. Pre-heat at 160C, 2~3 minutes. Soak into the molten solder bath of 2305C at 41 seconds. Exposure at 60C, 95% RH for 1000 hours. Characteristics are measured after the ambient air exposure of 2 hours. Exposure at 100C, for 1000 hours. Characteristics are measured after the ambient air exposure of 2 hours. Exposure at -40C, for 1000 hours. Characteristics are measured after the ambient air exposure of 2 hours. Solder the sample on PC board. 100 cycles of +100C for 30 minutes, -40C for 30 minutes. Characteristics are measured after the ambient air exposure of 2 hours. Monitor L change throughout temperature of -40C to +100C with reference to L at 20C. 3 Temperature cycling test Temperature coefficient C LL |
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